The first PVA brush design innovation in over 20 years
The TC-23™ PVA Brush System maximizes the efficiency of DI water and cleaning chemistries, revolutionizing the wafer cleaning process.
With the TC-23™, you'll witness a significant reduction in contaminating particles, translating to less break-in time, minimized wafer defects and significantly increased wafer production yields. The optimized fluid distribution delivers even cleaning performance and superior purging of contaminants.
The patent pending design of the TC-23™ reduces DI water and chemistries usage up to 47% , uses 70% less PVA than standard brushes resulting in less residual PVA particles and is crafted with non-toxic polypropylene for a greener more environmentally friendly approach to manufacturing.
compatible WITH MOST POST-CMP TOOLS
Increased Yields
70% Less PVA
up to 47% Less di water and chemistries
Less Break In Time
Eco Friendly
TC-23 PVA Eco Brush System
Industry-Standard Brush
- Less PVA
- Low level of contaminants
- Accelerated brush break-in
- Fluids flows exclusively through nodule
- Reduces DI and Chemistries usage
- Minimized environmental footprint
- Thick PVA Body
- High level of contaminates
- Long break-in
- Undirected waterflow
- High water usage
- Significant environmental impact
GET THE DATA!
Download the TC-23™ Data Sheet for Comprehensive Information on Advanced Run-Out Tests, Nodule Surface Analysis, and More!
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